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Technology Solutions for Collaborative Product Lifecycle Management – Status Review and Future Trend

School of Mechanical and Power Engineering, Shanghai Jiao Tong University, No. 1954 Huashan Road Shanghai, 200030, PR Chinaxgming{at}sjtu.edu.cn

J. Q. Yan

School of Mechanical and Power Engineering, Shanghai Jiao Tong University, No. 1954 Huashan Road Shanghai, 200030, PR China

W. F. Lu

Design Technology Institute, Department of Mechanical Engineering, National University of Singapore 9 Engineering Drive 1, 117576, Republic of Singapore

D. Z. Ma

School of Mechanical and Power Engineering, Shanghai Jiao Tong University, No. 1954 Huashan Road Shanghai, 200030, PR China

In the modern global economy, companies are facing ever-increasing challenges for short time-to-market to enter into the market early, for reduced time-to-volume to occupy the market quickly, and for decreased time-to-profit to get return from market shortly. Product lifecycle management (PLM) is recognized as one of the key leading technologies to facilitate companies to overcome these challenges, which will offer companies a new way to rapidly plan, organize, manage, measure, and deliver new products or services much faster, better, and cheaper in an integrated way. Following this trend, this study proposes a full scenario of technology solutions for PLM based on the complete analysis of business drivers, industry requirements, limit of current solution, and recent state-of-the-art review in the domain related to PLM. Potential industrial impact of the developed PLM technology solutions is analyzed. It is hoped that the proposed PLM technology solutions will form the frontier basis for further research, development, and application of PLM systems to quickly adapt to the dynamic changing market for industry companies to pursue the most advanced competitiveness.

Key Words: product lifecycle management • collaborative product service • product lifecycle process management • product lifecycle knowledge management • product data management

Concurrent Engineering, Vol. 13, No. 4, 311-319 (2005)
DOI: 10.1177/1063293X05060135


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